Kho Ching Tee, Elizabeth and Alexander, Hölke and Steven John, Pilkington and Deb Kumar, Pal and Ng, Liang Yew and Wan Azlan, Bin Wan Zainal Abidin and Marina, Antoniou and Florin, Udrea (2013) Methods to Suppress Earlier Leakage in 200V Superjunction LIGBT on Partial SOI. ENCON 2013.
Full text not available from this repository.Abstract
For most devices fabricated on SOI wafer, there is a consideration of backside coupling effect. This phenomenon becomes catastrophic if the device fabricated on the SOI wafer is an IGBT which consists of n-p-n-p structure and employs both the partial SOI and DTI technique. Earlier leakage had been found during development of 200V superjunction lateral IGBT (SJ LIGBT) that fabricated on SOI wafer. The purpose of this work is to identify the root cause and propose the solutions. This is done by 2D simulations and the proposed solution had successfully solved the earlier leakage problem and yield high breakdown voltage of 220V.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | SOI, IGBT, Coupling effect, research, Universiti Malaysia Sarawak, unimas, university, universiti, Borneo, Malaysia, Sarawak, Kuching, Samarahan, ipta, education |
| Subjects: | Q Science > Q Science (General) |
| Divisions: | Academic Faculties, Institutes and Centres > Faculty of Engineering Faculties, Institutes, Centres > Faculty of Engineering |
| Depositing User: | Meng |
| Date Deposited: | 02 Jul 2015 06:28 |
| Last Modified: | 02 Jul 2015 06:28 |
| URI: | http://ir.unimas.my/id/eprint/8166 |
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