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Ngie, David Chua Sing and Shahrol, Mohamaddan and Shirley, Jonathan Tanjong and Abdullah, Yassin and Lim, Soh Fong (2018) Detection of Bond Pad Discolorations at Outgoing Wafer Inspections. IEEE Transactions on Semiconductor Manufacturing, 31 (1). pp. 144-148. ISSN 0894-6507