Awang Masri, A.A (2002) A study on thermal management in electronic packaging components. [Final Year Project Report] (Unpublished)
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Abstract
Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component.
| Item Type: | Final Year Project Report |
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| Additional Information: | Project report (BSc.) - Universiti Malaysia Sarawak, 2002. |
| Uncontrolled Keywords: | Engineering, Thermal Management, TM, UNIMAS, Universiti Malaysia Sarawak, Awang Alias bin Awang Masri, university, universiti, Borneo, Malaysia, Sarawak, Kuching, Samarahan, IPTA, education, research, undergraduate |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Academic Faculties, Institutes and Centres > Faculty of Engineering Faculties, Institutes, Centres > Faculty of Engineering |
| Depositing User: | Karen Kornalius |
| Date Deposited: | 20 May 2014 08:17 |
| Last Modified: | 08 Feb 2023 06:44 |
| URI: | http://ir.unimas.my/id/eprint/2773 |
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