A study on thermal management in electronic packaging components

Awang Masri, A.A (2002) A study on thermal management in electronic packaging components. [Final Year Project Report] (Unpublished)

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Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component.

Item Type: Final Year Project Report
Additional Information: Project report (BSc.) - Universiti Malaysia Sarawak, 2002.
Uncontrolled Keywords: Engineering, Thermal Management, TM, UNIMAS, Universiti Malaysia Sarawak, Awang Alias bin Awang Masri, university, universiti, Borneo, Malaysia, Sarawak, Kuching, Samarahan, IPTA, education, research, undergraduate
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Academic Faculties, Institutes and Centres > Faculty of Engineering
Faculties, Institutes, Centres > Faculty of Engineering
Depositing User: Karen Kornalius
Date Deposited: 20 May 2014 08:17
Last Modified: 08 Feb 2023 06:44
URI: http://ir.unimas.my/id/eprint/2773

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