Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

Ngie, David Chua Sing and Shahrol, Mohamaddan and Shirley, Jonathan Tanjong and Abdullah, Yassin and Lim, Soh Fong (2018) Detection of Bond Pad Discolorations at Outgoing Wafer Inspections. IEEE Transactions on Semiconductor Manufacturing, 31 (1). pp. 144-148. ISSN 0894-6507

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Official URL: https://ieeexplore.ieee.org/document/8103795

Abstract

Deployment of an automatic visual inspection system in semiconductor industry has become increasingly popular than ever not only due to its relatively high value as a yield analysis tool of outgoing products but more importantly for the prevention of defect escapee. A lot of studies are done on the application of in-line defect scan but the application of outgoing wafer inspection at post-fab environment has been very limited and rarely found in literature. With rapid growth of automotive application in worldwide industry, the importance of quality of the wafer at die level has never been so critical. This paper provides a method for detection of bond pad discolorations at outgoing quality check especially in semiconductor industry. An effective method for detection of the bond pad discolorations was proposed. The advantages and disadvantages of the detection method are discussed. Factors that are affecting the performances of the detection method are also described and analyzed. © 2017 IEEE.

Item Type: Article
Uncontrolled Keywords: Bond pad, discoloration, inspection, outgoing, Polyimide, wafer, unimas, university, universiti, Borneo, Malaysia, Sarawak, Kuching, Samarahan, ipta, education, research, Universiti Malaysia Sarawak.
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Academic Faculties, Institutes and Centres > Faculty of Engineering
Depositing User: Ibrahim
Date Deposited: 27 Mar 2018 03:51
Last Modified: 28 Apr 2021 22:37
URI: http://ir.unimas.my/id/eprint/19916

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